Thursday, March 23, 2017

Interrelation Profile Analysis Method for Alignment of Polarization-Maintaining Fiber

AFL White Paper By –

Wenxin Zheng, Doug Duke, Toshiki Kubo, and Bryan Malinsky


A new method for alignment of polarization-maintaining (PM) fibers has been developed that solves alignment problems with low-contrast PM fibers. It provides a fast and accurate universal method for PM fiber alignment.

Contact AFL for a copy of the White Paper:

Monday, March 20, 2017

MEMS and sensors suppliers Collaboration, May 10-11 at Stanford University (Stanford, Calif.)

MEMS & Sensors Industry Group Tackles Technical Challenges at Annual Technical Congress

MEMS and sensors suppliers thrive through collaboration, May 10-11 at Stanford University (Stanford, Calif.)

PITTSBURGH -- (March 20, 2017) -- Microelectromechanical systems (MEMS) and sensors suppliers are targeting a rapidly growing global market for their devices, key components that increase the intelligence and interactivity of billions of electronic products. Despite this unprecedented growth, suppliers face shared technical challenges that limit expansion, including energy and power management, security, integration, and machine learning. MEMS & Sensors Industry Group’s (MSIG’s) 2017 MEMS & Sensors Technical Congress® (MSTC), to be held on May 10-11, 2017 on the campus of Stanford University, offers attendees a collaborative approach to resolving these shared technical challenges.

“The size, diversity and growth of MEMS and sensors markets is exploding,” said Karen Lightman, vice president, MEMS & Sensors Industry Group, SEMI. “To succeed in these large, increasingly challenging and fast-moving markets, MEMS and sensors suppliers need to work together, delving deeper into the issues and possible solutions of their shared challenges. MSTC 2017 gives suppliers a forum for freely exchanging information with peers through breakout sessions. It also gives them access to some of the top technical minds in the industry, including our two keynote speakers: Scott Borg, director and chief economist of U.S. Cyber Consequences Unit, and Chris Ré, assistant professor, Department of Computer Science, Stanford University.”

Borg will discuss how economics is driving both the deployment of MEMS and sensors and their exploitation by attackers. “As MEMS and sensors enable the Internet of Things, building cyber security into them is going to be critical,” said Borg. “Letting cyber attackers take control of these increasingly ubiquitous devices could result in chaotic and even dangerous situations. Individual home appliances, for example, that do not seem to pose a threat, taken one by one, could present a serious risk if a cyber attacker could manipulate millions of them at once. Because cyber attacks can be carried out on vast numbers of targets simultaneously, this is a real possibility.”

Ré will share new approaches to improving machine learning systems -- which are indispensable to applications such as voice recognition, image search and natural language processing. “Developing machine learning systems is typically a laborious process, hampered by large training sets that require hand-labeled data,” said Ré. “We are employing new techniques that overcome a major bottleneck to developing machine learning systems, making the building of these systems easier for an increasingly larger set of people.”

Featured presenters from AMFitzgerald, Coventor, Excelitas Technologies, Plasma-Therm, Silicon Microgravity, Si-Ware Systems, Stanford University, STMicroelectronics and Tohoku University will address topics spanning integration, easier customization, manufacturing, material analysis, high-performance micromirror arrays, and smart sensors for robotics.
A panel of industry and academic experts will explore Academic and Commercial Perspectives on Capturing Value from MEMS and Sensors.
Breakout sessions will include:

·  Technology Transfer for Dummies (How to Get to a Stable High-yielding Process)
·     Back-end Challenges of MEMS and Sensors (Packaging, Testing & Reliability)
·    Integration Opportunities (Technological & Business Considerations)
·     Emerging MEMS, Sensors and Systems Incorporating Them
· Piezoelectric and Other Emerging Materials for MEMS and Sensor Applications

For the complete agenda of the 2017 MEMS & Sensors Technical Conference, visit:

For More Information and Registration

MEMS & Sensors Technical Congress will take place May 10-11, 2017 at Stanford University, Bechtel Conference Center in Stanford, Calif.  Sponsors include NXP and X-FAB.

MSIG/SEMI members receive a discount, with additional early-bird pricing for members and non-members through March 28, 2017. Register via: or contact MSIG at  for more information.

About MEMS & Sensors Industry Group

MEMS & Sensors Industry Group (MSIG), a SEMI Strategic Association Partner, advances MEMS and sensors across global markets. MSIG advocates for near-term commercialization of MEMS/sensors-based products through a wide range of activities, including conferences, technical working groups and industry advocacy. As a SEMI Strategic Association Partner, MSIG now reaches a global membership of more than 1,900 companies and industry partners. For more information, visit: and follow MSIG on LinkedIn and Twitter (use @MEMSGroup).

MEMS & Sensors Industry Group and the MEMS & Sensors Industry Group logo are trademarks of SEMI. All other product and company names are trademarks or registered trademarks of their respective holders.

Thursday, March 16, 2017

10-Year Fiber Optic Connector Market Forecast

According to ElectroniCast, the worldwide fiber optic connector/mechanical splice consumption value reached $3.82 billion in 2016…

Aptos, CA (USA) – March 16, 2017 -- ElectroniCast Consultants, a leading market & technology forecast consultancy addressing the fiber optics communications industry, today announced the release of their annual market forecast and analysis of the use of fiber optic connectors and mechanical splices in communication applications.  This study is based on analysis of information obtained continually for over 30-yearts, and updated through the middle of March of 2017.

According to ElectroniCast, the worldwide fiber optic connector/mechanical splice consumption value reached $3.82 billion in 2016.  Multimode connector use is forecast to grow from nearly $2.46 billion in 2016 to over $3.2 billion in 2026.  Multimode fiber is best suited for use in short lengths, such as those used in Local Area Networks (LANs), Data Centers (DCs) and other private enterprise applications, as well military/ aerospace, harsh environment and specialty applications (automotive, sensors, medical, oil/gas and others).

“The multimode LC small form factor connector is forecast to maintain the leadership position in relative market share throughout the forecast period,” said Stephen Montgomery, Director of the Fiber Optic Component group at ElectroniCast. 

“Field-installable connectors for indoor and outdoor use are increasing in demand and thus are increasing in volume for several end-use options. Both mechanical-splice and fusion-splice technologies are meeting the requirements in the field-installable fiber optic connector availability,” Montgomery added.

The global fiber optic connector/mechanical splice consumption is driven by a dramatic increase in bandwidth demand beyond the limits of copper.  As optical fiber use migrates closer and closer to the end user, where cable lengths are shorter with higher fiber counts, the requirements for jointing fibers becomes more critical. Splicing and connecting, play a significant role in a network’s cost and performance.

There are over 90 vendors competing for the global fiber optic connector/ mechanical splice market, which ElectroniCast tracks in a product matrix showing participation in the following: connectors, cable assemblies, optical backplanes, and fiber optic installation apparatus; however, is dominated by a few companies that have a broad base in various interconnect products. 

This report is available immediately from ElectroniCast Consultants.  For detailed information on this or other services provided by ElectroniCast, please contact Theresa Hosking, Director of Marketing/Sales;  (Telephone/USA: 831-708-2381)

ElectroniCast Consultants – specializes in forecasting trends in communication networks and in the products used in those networks.  This includes technology forecasting, markets and applications forecasting, strategic planning and consulting. ElectroniCast Consultants, as a technology-based independent forecasting firm, serves industrial companies, trade associations, government agencies, communication and data network companies and the financial community.  Reduction of the risk of major investment decisions is the main benefit provided.  ElectroniCast Consultants’ goal is to understand the challenges and opportunities facing clients and to provide timely, accurate information for strategic planning.

Monday, March 13, 2017

A revolution is coming in fiber optic interconnects

nanoPrecision Products announced the commercial launch at OFC 2017 of their breakthrough Ferrolder®, a titanium-constructed fiber optic interconnect with ferrule and holder in one piece.

Representing the first true innovation in fiber optic interconnects in more than four decades, the Ferrolder can be assembled onto a fiber without epoxy. Designed for single-mode or multimode applications, the Ferrolder is qualified for “Single Optical Connector SC-UPC (Ultra Physical Contact)kit” by Verizon and will initially be available in SC UPC connectorized fiber cable assembly format, followed shortly by Angled Physical Contact (APC) format.

The company also is announcing the launch of the Football Ferrule, a single-mode or multimode, multi-fiber interconnect system based on the SC form factor. Like the Ferrolder, the Football Ferrule has nano-scale features that hold fibers without epoxy. Following its commercial launch at OFC, the breakthrough interconnect system will initially be available in multimode SC connectorized fiber cable assembly format, followed shortly by single-mode SC format.

nanoPrecision Products, Inc.
Robert King
VP, Sales & Marketing    

See the Company Site:

Thursday, March 9, 2017

High-density connectors for data center cabling

High-density connectors for data center cabling certified in accordance with the IEC standard 

EUROMICRON Werkzeuge GmbH, a euromicron Group company, has successfully had its URM (yoU aRe Modular) fiber-optic connectors certified in the standardization process of the International Electrotechnical Commission (IEC). URM is a multi-fiber connector system in a small form factor design and has been specifically designed for high-density applications in data centers. In October 2016, the URM connectors developed in Germany assumed a firm place in the IEC 61754 series of standards for defining optical connectors and have been bindingly regulated in the individual standard IEC 61754-34:2016-10 (Fiber optic interconnecting devices and passive components – Fiber optic connector interfaces – Part 34: Type URM connector family).

They are available as two- and eight-fiber connectors and impress with a high packing densi-ty, as well as ultra-precise, spring-loaded ceramic ferules. Due to the fact that every single fiber is guided individually, they permit ideal polishing of the fiber end faces, with the result that URM connectors achieve a low insertion loss of less than 0.2 dB. In data center cabling, the URM system is thus a powerful alternative to MPO connectors and permits direct adapta-tion of the IEEE 802.3bm standard from Base-12 to Base-8 connectivity. The performance advantage of the URM connector is of significance in particular on transmission links with a low loss budget, such as in the current development in high-speed data traffic from 40Gb Ethernet, up to 100-GbE and 400-GbE or up to 32-GB Fibre Channel.

The URM connectors are manufactured by EUROMICRON Werkzeuge GmbH (Sinn-Fleisbach/Central Hesse). The connectors are processed into high-performance cabling systems for data centers by euromicron’s subsidiary LWL-Sachsenkabel GmbH in Gornsdorf/Ore Mountains.

You can find more details on the euromicron URM connector system on the URM microsite at

The official publication of the individual standard IEC 61754-34:2016-10 can be obtained from the publisher VDE-Verlag at

Smiths Interconnect Launches Brand Transition

March 6, 2017


Smiths Interconnect, a division of Smiths Group plc, today announces it is unifying its technology brands of EMC Technology, Hypertac, IDI, Lorch, Millitech, RF Labs, Sabritec, TECOM, and TRAK under the single brand identity of ‘Smiths Interconnect’.

This brand transition supports a recent strategic reorganisation focused on creating a more agile structure that can better anticipate and respond to customers’ evolving needs.

Individually, the technology brands represent state-of-the-art solutions across the connectors, microwave components and microwave subsystems markets. Providing a strong umbrella brand that supports the breadth of these products and technologies will make Smiths Interconnect a more comprehensive solutions provider, improving the customer experience by streamlining access and interactions across multiple applications.

“Over time, interactions among our brands have increased across many of our markets,” said Roland Carter, President of Smiths Interconnect. “Aligning all this activity under the Smiths Interconnect name will make us a more streamlined partner, enhancing our customers’ access to the combined strength of our products, expertise and application knowledge.”

The individual technology brands will continue to be visible in association with the Smiths Interconnect brand during the transition period. Customers and other stakeholders are encouraged to visit for more information.

About Smiths Interconnect

Smiths Connectors offers both multimode and single-mode fiber optics. Fiber optic contacts support wide-bandwidth applications and are suitable for inclusion in a broad variety of connector styles. All fiber optic connectors and contacts are offered fully terminated and tested ensuring signal integrity for rugged application environments.

Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets. Smiths Interconnect is synonymous with exceptional performance whenever a technologically advanced, high quality solution is required to ensure reliability and safety.

Smiths Interconnect is part of Smiths Group, a global leader in applying advanced technologies for markets in threat and contraband detection, energy, medical devices, communications and engineered components.  Smiths Group employs approximately 22,000 people in more than 50 countries.


Seikoh Giken at OFC 2017

Seikoh Giken will exhibit full line of their interconnect, polishing and cleaning products.

Highlighted exhibiting items are:

Passive Device
  • LC Uniboot Connector
  • Shuttered Connector / Adaptor
  • Angle boot / Short boot
  • Multi Channel Fiber Pigtail
  • Receptacle Pigtail

Polisher & Cleaner
  • New polishing machine SFP-560A and New small MT polisher SFP-70D-MT
  • One-lever action (Quick loading type) MT polishing holder
  • Large diameter drop cable polishing solution for both Single fiber and MT
  • Cloth type HandiMate SHM-503 cleaner
  • New Benchtop Fiber Cleaner SPR-2