Market Forecast and Analysis: Photonics and Electronics
ElectroniCast – www.electronicast.com
ElectroniCast, founded in 1981, specializes in forecasting trends in technology, markets, and applications forecasting, strategic planning and consulting. ElectroniCast Consultants, as a technology-based independent forecasting firm, serves industrial companies, trade associations, government agencies, communication and data network companies, and the financial community.
Scientists at the University of Southampton, in collaboration with Penn State University have, for the first time, embedded the high level of performance normally associated with chip-based semiconductors into an optical fibre, creating high-speed optoelectronic function.
The potential applications of such optical fibres include improved telecommunications and other hybrid optical/electronic technologies. This transatlantic team will publish its findings in the journal ‘Nature Photonics’ this month.
The team has taken a novel approach to the problems traditionally associated with embedding this technology. Rather than merge a flat chip with a round optical fibre, they found a way to build a new kind of optical fibre with its own integrated electronic component, thereby bypassing the need to integrate fibre-optics onto a chip.
To do this, they used high-pressure chemistry techniques to deposit semiconducting materials layer by layer directly into tiny holes in optical fibres.
Dr Pier Sazio, Senior Research Fellow in the University of Southampton’s Optoelectronics Research Centre (ORC), says: “The big breakthrough here is that we don't need the whole chip as part of the finished product. We have managed to build the junction - the active boundary where all the electronic action takes place - right into the fibre. Moreover, while conventional chip fabrication requires multimillion dollar clean room facilities, our process can be performed with simple equipment that costs much less.”
John Badding, Professor of Chemistry at Penn State, explains: “The integration of optical fibres and chips is difficult for many reasons. First, fibres are round and cylindrical, while chips are flat, so simply shaping the connection between the two is a challenge. Another challenge is the alignment of pieces that are so small. An optical fibre is 10 times smaller than the width of a human hair. On top of that, there are light-guiding pathways that are built onto chips that are even smaller than the fibres by as much as 100 times, so imagine just trying to line those two devices up. That feat is a big challenge for today's technology."
Dr Anna Peacock, from the ORC who holds a Royal Academy of Engineering Research Fellowship, adds: “The incorporation of optoelectronic device functionality inside the optical fibre geometry is an important technological advance for future communication networks. In this sense, we can start to imagine a scenario where the data signal never has to leave the fibre for faster, cheaper, more efficient systems.”
The research also has many potential non-telecommunications applications. It represents a very different approach to fabricating semiconductor junctions that the team is investigating.
ORC Postdoctoral Researcher, Dr Noel Healy concludes: “This demonstration of complex in-fibre optoelectronic engineering is exciting, as it has the potential to be a key enabling technology in the drive for faster, lower cost, and more energy efficient communication networks.”
The research was funded by the Engineering and Physical Sciences Research Council of the United Kingdom and the U.S. National Science Foundation.
Skorpios Technologies, Inc. was founded in July 2009 as an optical communications company focused on revolutionizing the transceiver and subsystem supply chain to enable the delivery of truly next generation high speed infrastructure products.
Together with their foundry partner, Skorpios designs, develops and manufactures integrated optical modules and subsystems in support of the entire opto-electronic communications ecosystem.
Skorpios’ technology allows the generation, detection and modulation of light to be monolithically integrated with high-speed electronic circuits in a standard CMOS-compatible process known as Composite-Semiconductor on Insulator (C-SOI) and is fully supported within existing standard CMOS foundry processes.
Their proven ability to offer all of these fundamental building blocks within the standard CMOS manufacturing environment is what differentiates Skorpios from other companies in this market space.
Back in November (2011) the company announced a follow-on investment to its Series B round of $19 million. The additional $2 million provided by T-Venture, Deutsche Telekom's venture capital company, brings total investment in the round to $21 million.
"We are delighted to welcome Deutsche Telekom to the investment syndicate," said Stephen Krasulick, president and CEO of Skorpios Technologies. "The support of global carriers, such as Deutsche Telekom, in addition to major equipment companies and systems integrators, validates the market need for Skorpios' differentiating component technology. Our platform is a key enabler to reducing costs and improving performance in next-generation optical communications equipment."
"The integration of today's separated building blocks into a single chip provides various important effects for our network, such as capex and opex savings at the aggregation layer and core, but also the economic enabling of new technologies that are essential to our strategy," said Bruno Jacobfeuerborn, Director of Technology, Telekom Deutschland GmbH. "We are happy to support Skorpios in the realization of this disruptive approach with the investment from T-Venture."
The $21 million in Series B funding will be used to expand Skorpios Technologies' infrastructure and complete the commercialization of its core technology, an advanced composite semiconductor on insulator technology that will enable the next generation of optical networking equipment.
Other investors in this round include leaders in the communications networking ecosystem, along with return venture capital investors Cottonwood Technology Fund and Sun Mountain Capital. www.skorpiosinc.com.
About T-Venture
T-Venture Holding GmbH was founded in 1997 as a 100% subsidiary of Deutsche Telekom AG. Since then, T-Venture have invested in young companies that demonstrate economic and technological synergy with the business ideas of Deutsche Telekom and who also promise an above-average potential for growth. The company is based mainly in Bonn and supports and supplements the commitment of T-Venture of America Inc. in Foster City, Silicon Valley and in Seattle. Regional areas of core investment activity are in Europe, the United States of America and in Asia. Currently T-Venture manages the T-Mobile Venture Fund, the Connected Life and Work Fund, the T-Home Venture Fund, the T-Systems Venture Fund, and the T-Corporate Venture Fund.
About Cottonwood Technology Fund (CTF)
Cottonwood Technology Fund (CTF) is an early-stage technology commercialization fund with offices in El Paso, Texas, Los Alamos, New Mexico, and Santa Fe, New Mexico. It aims to cultivate the entrepreneurial community of the Paso del Norte region running along the Rio Grande River from Los Alamos, New Mexico to El Paso, Texas. It is an area rich in resources, host to two federal labs (Los Alamos and Sandia), two medical centers (the University of New Mexico Health Services Center and the Texas Tech University Health Services Center at El Paso), and four engineering schools and research universities (UNM, UTEP, NM Tech and NM State). Collectively, they represent more than $4.0 billion in annual research across critical fields such as Bio-Sciences, New Energy, Nanotechnology, Information Technologies, CleanTech and Aerospace. CTF will work to provide venture services and capital to tech transfer opportunities having strong commercial potential.
About Sun Mountain CapitalSun Mountain Capital is an investment partnership formed by senior private equity professionals based in Santa Fe, New Mexico. The Firm’s professionals have a depth of experience in private equity that dates back to 1981 and have an extensive track record of creating value through fund advisory activities and direct investments in promising companies. Prior experience for the principals include employment at Credit Suisse First Boston, Morgan Stanley, Brentwood Associates, Fort Washington Investment Advisors, GE Capital, Kline Hawkes, and The Boston Consulting Group, among other top tier firms.
PORTLAND, OR, Feb 09, 2012 -- Timbercon, Inc., a fiber optics product and solutions manufacturing company, announced today the availability of its Modular Deployable Reel System (MDRS), a lightweight cable deployment system designed for mobile fiber optic installations. The reel system is ideal for applications requiring quick deployment and retrieval, particularly in harsh environments.
Timbercon's MDRS is constructed of high-impact glass reinforced polymer materials that are durable, lightweight and resistant to rust. There are five reel sizes available: 100M, 300M, 500M, 750M and 1000M. A retractable crank and handle system allows operators to easily rotate the reel during payout or take-up. The MDRS design also meets or exceeds all MIL-R-3241E requirements.
The modular design makes the deployment system ideal for applications where cable needs to be deployed, reeled-in quickly and then stored efficiently in tight spaces. The MDRS is easily transported in an optional carrying case that stacks and interlocks during transit. Timbercon also offers tripods for varying reel sizes, a deployment cradle and a reel backpack.
"Deploying and retrieving fiber optic cable quickly is cumbersome under the best of conditions and in harsh environments, it's even more difficult," said Nolan Pitts, Key Account Manager. "Timbercon's MDRS is a great improvement over traditional reels that can easily rust and are heavy to transport."
About Timbercon, Inc. Founded in 1997, Timbercon, Inc. is a fiber optic product and solution manufacturing company providing a wide array of connectivity solutions to the military, harsh environment, broadcast, medical, data storage, telecommunications, industrial and networking industries. In addition to standard fiber optic assemblies and attenuated loopbacks, Timbercon has pioneered proprietary products, many of which are now considered to be an industry benchmark. Additional company information can be found at www.timbercon.com .
I just-found this abstract, which I found very useful while studying the market for OTDRs...
Research Paper Abstract -
The coherent optical time domain reflectometer (COTDR) based distributed temperature and strain sensing is studied in this paper. The sensing principle is analyzed and discussed in detail. Rayleigh backscattering in a single-mode optical fiber is measured by COTDR with a precisely frequency-controlled light source, and the cross-correlation of the Rayleigh backscattering is calculate to detect the frequency changes of the cross-correlation peak caused by the changes of temperature and strain. We perform simulations on the COTDR based sensing system by computer and draw some conclusions.
The Yokogawa DTSX200 distributed temperature sensor (DTS) is used to monitor temperature, leaks, and flow in oil/gas downhole, pipeline, LNG/refinery tank/reactor vessel, fire detection, and other industrial thermal applications.
Released in October 2011, the DTSX200 is the first distributed temperature sensor with a STARDOM field controller option, which improves production efficiency by working together with production control systems. The DTSX200 is being field tested for oil/gas in-well applications by some major oil companies. The DTSX200 is also being proposed for pipeline and tank leak detection systems. Yokogawa developed the DTSX200 using optical measurement technologies that it acquired over the years in the measurement field, and has combined it with the STARDOM field controller for additional measurement, control, and data communication capabilities. Yokogawa is the only company that provides an integrated automated solution comprised of the DTSX200, DCS, SCADA, and field instruments.
The DTSX200 sets a new standard for distributed temperature sensing in performance, price, and interface to production control systems. The DTSX200's modular design allows interchangeable configurations with up to 16 channels, the Yokogawa STARDOM field control option, and multiple power supplies. With an operating temperature of -40 degrees C to +65 degrees C, it can be used in all regions worldwide. The DTSX200's low power consumption and wide operating temperature make it ideal for installation in remote locations and harsh environments, utilizing a standalone outdoor housing, solar power, and wireless communication. You can expect the DTSX200 to have the same high performance and reliability found in all other Yokogawa products and solutions.
About Yokogawa
Yokogawa's global network of 25 manufacturing facilities and 80 companies spans 54 countries. Since its founding in 1915, the US$3 billion company has been engaged in cutting-edge research and innovation, securing more than 7,200 patents and registrations, including the world's first digital sensors for flow and pressure measurement. Industrial automation and control, test and measurement, information systems and industry support are the core businesses of Yokogawa. For more information about Yokogawa, please visit the website www.yokogawa.com
Monthly Journal Published: The first-week of each month
Fee:No Charge (12-issues) for Existing FO Sensor Forecast Clients*
Fee: $1,200 per year (12-issues) for Monthly Journals - only
ElectroniCast publishes a summary-level report of the latest market and technology trends covering the area of fiber optic sensors
* Clients that have subscribed to the Fiber Optic Sensors Global Market Forecast and Analysis, within the last 12-months
This journal provides a review and analysis of current market and technology trends relative to the consumption of communication-based fiber optic sensors. The journal (PDF file: typically 30-40 pages), released at the beginning of each month, via e-mail, providing our clients with insights to the innovative applications of fiber optic sensors.
The journal typically presents information in three sections:
·Fiber Optic Sensors – Market Overview
·Selected Highlights of Technology Presentations and Company News
·Calendar – Future Conferences
Summary-level consumption trends are provided for various measurand or technology.The trends for each selected sensor, in turn, is segmented into various applications. The information is presented in easy-to-follow illustrations and text.
The complete quantitative Microsoft Excel market forecast worksheets and competitive market share estimates are released every September for clients that subscribe to the Fiber Optic Sensors Market Forecast annual report; however, the monthly reports provide summary-level market forecast data updates and the latest industry news.
For professionals concerned with fiber optic sensor markets and technology.
We believe you will find this journal useful for your planning of product and market development.Please contact us with any questions or comments.
SAMPLE – the Table of Contents of the February (2012) journal is provided below:
Contract News: Teledyne Agreement with FMC Technologies
Contract News: TeraXion Selects Honeywell for Laser Solutions Next-Gen FOGs
Contract News: Fiber Optic Testing to Support US Navy Aviation Systems
Product News: Fiber Optic Sensors: S7 Series
Product News: Ultra-Narrow Linewidth Laser Module Introduced by Oewaves
Transfer Opportunity News: Interferometric Fiber Optic Bragg Grating Sensors
Research and Development News: Water-Quality Monitoring
Research News: Fiber Optic Sensors Pick up (Sound) Frequencies
Research Presentation: Monitoring Enhanced Geothermal Systems
Research Paper: Measurement of Hydrocarbons in Produced Water
Research Paper: Thin-core fiber tailored Bragg grating reflection
Calendar – Future Conferences
Fiber optic sensors use optical fiber either as the sensing element ("intrinsic sensors"), or as a means of relaying signals from a remote sensor to the electronics that process the signals ("extrinsic sensors"). The market trends discussed in the monthly journal address one or more of the following topics:
·Fiber Optic Point Sensors: Component-Level
·Continuous Distributed Fiber Optic Sensors
·Optical Communication Signal Analysis Interface Components/Modules
·Test & Measurement used in Telecommunication, CATV, Private/Enterprise
·Biomedical/Science
·Petrochemical/Energy/Utilities/Natural Resources
·Automotive/Vehicle
Sensing/Measuring Quantity (Measurand) The monthly journal also looks at the industry trans and news pertaining to fiber optic point sensors, segmented further by the following sensing/measuring quantity (measurand) types:
·Mechanical Strain
·Temperature
·Pressure
·Chemical, Gas, Liquid
·Vibration, Acoustic, Seismic
·Displacement, Acceleration, Proximity
·Electric and Magnetic Field - Fiber Optic Sensors
·Rotation (such as Fiber Optic Gyroscopes: FOGs)
Continuous Distributed Sensor Applications/Technologies covered in the journal:
Optical Communication Signal Analysis Interface Components/Modules
These include components, sampling/interface modules and intra-enclosure (board-level) elements directly used for fiber optic sensing measurements, used in equipment such as –Oscilloscopes, OTDRs, Bit Error Rate Testers, Signal Generators, Spectrum Analyzers, and numerous other test/measurement/monitoring equipment used for communication/optical signal processing applications.We discuss the trends, segmented by the following applications:
·Telecommunications
·Private Enterprise Data Networks
·Cable TV
·Military/Aerospace/Security
·Other
Through the course of the 12-month issue cycle, the journal will provide current news and analysis study of applicable technologies, including:
·Interferometry
·Intensity
·Polarization
·Fiber Bragg Grating (FBG)
·Raman back-scattering
·Fluoresence
·Brillouin waves
·Doppler Anemometry
·Spectroscopy
·Waveguides/ Specialty Optical Fiber
·Optrode
Product and Financial news form various fiber optic sensor vendors are presented in the monthly journal along with a calendar of future conferences, which address the fiber optic sensor industry sector.